Shulou(Shulou.com)11/24 Report--

Thank you, Mr. Air, a netizen of CTOnews.com, for your clue delivery! CTOnews.com news on July 25, comprehensive Dongfeng Automobile official account, Wuhan Economic Development Zone official account, Nine School News and other media recently reported that the Hubei vehicle specification chip industry technological innovation consortium led by Dongfeng Motor priority Company has achieved some results in the control of key core technologies since its establishment one year ago. At present, three types of automotive specification-level chips have been produced for the first time (CTOnews.com Note: integrated circuit noun, refers to "trial production"), filling in the gaps in related domestic industries.

According to reports, with the gradual electrification, intelligence and networking of automobiles, the market demand for gauge-level chips continues to rise. In 2022, for example, China's automotive chip market was 15.8 billion US dollars, an increase of 10.49 percent over the same period last year.

In May 2022, Dongfeng Company took the lead in uniting 8 units, including China Xinke, Wuhan Lingdian, Wuhan Technology, Huazhong University of Science and Technology, Xinlai Technology and Taijing Technology, to jointly build the "Hubei Automotive Specification-level Chip Industry Technology Innovation Consortium". Committed to promoting the development of chip localization supply chain.

Dongfeng Company takes the lead in starting from the chip demand, China Xinke binary Semiconductor Corporation, Huazhong University of Science and Technology, Xinlai Technology, etc., after demand analysis, system design, module design and verification, and then processed by the wafer closed test factory. The China Automotive Technology Research Center is responsible for the testing of vehicle gauge-level chips, and finally realizes mass production application in Dongfeng Company.

According to you Zheng, deputy general manager of Dongfeng Company, the consortium led by Dongfeng has completed China's first automotive specification-level MCU chip based on RISC-V instruction set, breaking through core technologies such as automotive chip definition, design, and technology, and gradually realizing key chips "from scratch", driving the automotive industry to solve the chip problem and firmly promote the replacement of domestic chips.

The consortium also produced more than 50 invention patents and integrated circuit layouts, 1 drafter-level chip group standard, and won 2 gold and silver awards for high-value patents in Hubei Province in 2022.

Zhao Ning, director of the consortium office and director of the Intelligent Software Center of Dongfeng Technology Center, said, "if the mainframe factory takes the lead in designing the chip, it can create its own ecology according to its own needs definition, combine the system and software, create differentiation and competitiveness, and ensure the security of the supply chain."

It is said that Dongfeng has formulated a strategy for the development and application of domestic chips in the fields of automobile central gateway, intelligent cockpit, autopilot and power control, which is expected to achieve full coverage of powertrain, chassis, body and new energy control.

In addition, in the future, the localization rate of Dongfeng brand-new model chip will reach 40%, and the specification-level chip will not only be carried on Dongfeng company's entire vehicle, but also will be promoted and applied in other domestic brands.

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