Shulou(Shulou.com)11/24 Report--

CTOnews.com, July 21, according to BusinessKorea, SK Hynix said at a recent investor briefing that the company aims to double sales of HBM and DDR5 chips, important components of AI servers, next year.

▲ source Pexels due to the surge in demand for AI, the price and demand for HBM and DDR5 chips are increasing. The high-performance memory HBM that vertically connects multiple DRAM is 5-6 times more expensive than the existing DRAM products, and the price of the latest DDR5 is 15% higher than that of the previous DDR4.

SK Hynix currently accounts for less than 1 per cent of sales of HBM products, but sales account for about 10 per cent. If the HBM3 and DDR5 businesses double in size, it is expected to accelerate revenue growth and profit improvement. Given that SK Hynix is expected to lose more than Won6 trillion in the first half of this year (CTOnews.com Note: currently about 33.78 billion yuan), the target is also interpreted as a rebound in performance through the high value-added memory market.

SK Hynix, which previously launched the world's first 12-tier HBM3 product, said at a briefing that it expected the size of its HBM and DDR5 product lines to more than triple by 2024.

SK Hynix also revealed a specific roadmap for its next-generation products, setting a production target for the sixth-generation HBM product, HBM4, in 2026. At present, SK Hynix has determined the first half of next year as the mass production time of its next generation product HBM3E.

The competition for technology around high value-added DRAM in the semiconductor industry, including SK Hynix, is expected to become increasingly fierce. Samsung Electronics plans to start HBM3 production by the end of this year and plans to invest hundreds of billions of won to double the HBM production capacity of the Zhongnan Tianan plant. Starting from the fourth quarter, Samsung's HBM3 will also be supplied to Nvidia, a big customer currently monopolized by SK Hynix.

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