Shulou(Shulou.com)11/24 Report--

CTOnews.com July 17 news, According to Taiwan media "United Daily News" quoted sources reported that due to the need to deal with AI wave, TSMC will change Kaohsiung plant plan, Plan from the original "mature process" to a more advanced 2nm process, Expected to mass production in the second half of 2025, And related plant planning will also be announced in the near future.

However, it should be noted that TSMC will hold a legal briefing on July 20 (CTOnews.com Note: Performance briefing for corporate investment institutions). At present, the company is in a "quiet period before the meeting" and will not make any comment on this matter for the time being.

Sources pointed out that TSMC 2nm needs more investment than the originally planned 28nm, and the company has reported to the local authorities that it hopes to obtain assistance in water supply and power supply. Because the 2nm process requires more power-consuming equipment, there is a certain probability that the environmental impact differential analysis needs to be re-completed.

It is reported that TSMC's 2nm process will be 10-15% faster than the 3nm process at the same power consumption, while power consumption can also be reduced by 20-30%. At present, the main production base of 2nm process is located in Baoshan, Hsinchu, and four factories are planned to be built. It is expected that risky trial production will be carried out in 2024 and mass production will be carried out in the second half of 2025.

CTOnews.com previously reported that Apple has ordered 90% of TSMC's 3 nm process wafers for the production of A17 Bionic and M3 chips. However, the current yield of this advanced process is only 55%. TSMC expects to be able to produce 100,000 3-nanometer wafers per month by the end of 2023 to meet Apple's demand.

However, with a yield of only 55%, only 55,000 wafers can be used. Apple will pay the standard wafer price only if the yield reaches 70%, but that is reportedly not likely to happen until the first half of 2024.

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