Shulou(Shulou.com)11/24 Report--

CTOnews.com July 15 news, according to DigiTimes, TSMC is actively expanding CoWoS packaging capacity to meet the needs of AWS, Broadcom, Cisco, Nvidia and Xilinx.

Nvidia dominates artificial intelligence and high-performance computing, but one of the main reasons for the shortage of computing GPU is TSMC's limited CoWoS packaging capacity.

CTOnews.com Note: CoWoS (Chip On Wafer On Substrate) is a 2.5D integrated production technology, which first connects the chip to the silicon wafer through the packaging process of Chip on Wafer (CoW), and then connects the CoW chip to the substrate (Substrate) to integrate into CoWoS.

TSMC plans to increase the monthly production capacity of CoWoS packages from 8000 to 11000 by the end of 2023 and to 14500-16600 by the end of 2024.

There are rumors that Nvidia plans to increase the CoWoS packaging production capacity to 20,000 wafers by the end of 2024, but the above information is not from the official, there may be a deviation from the actual.

DigiTimes reported that major technology giants such as Nvidia, Amazon, Broadcom, Cisco and Xilinx have increased demand for TSMC's advanced CoWoS packaging, forcing TSMC to renew orders for necessary equipment and materials.

Nvidia has booked 40 per cent of TSMC's CoWoS capacity over the next year. However, due to severe shortages, Nvidia has begun to explore options with its secondary suppliers to place orders with Amkor Technology and United Microelectronics (UMC), but these orders are relatively small.

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