Shulou(Shulou.com)11/24 Report--

CTOnews.com, July 13, according to South Korean media The Elec, Samsung Display has begun to develop LEDoS (LED on Silicon) technology for augmented reality (AR) devices, and its microLED chip size can be less than a few microns.

Tu Yuan: Kim Gong-min, Executive Director of the Technology Strategy team of Samsung Display R & D Center, made the remarks at "Deep Tech Forum 2023", which was held at the Northeast Asia Trade Building in Sendong, Seoul, South Korea on the 11th.

Apple's Apple Vision Pro head display OLEDoS (OLED on Silicon) technology focuses on depositing organic light-emitting diodes (OLED) on silicon substrates.

OLEDoS can be used to block virtual reality (VR) devices in the external environment, but it is difficult to apply to augmented reality (AR) devices because of the limitation of brightness.

Some of the speeches translated by Kim Gong-min by CTOnews.com are as follows:

OLEDoS can not meet the requirements of AR equipment in terms of brightness, light shape and product life conditions.

Our goal is to ensure that the existing features / features are technically as small as possible, ensuring higher resolution and brightness, better features and product life. We are developing LEDoS technology using light emitting diodes (LED).

Kim Gong-min also admitted that one of the current challenges is the backplane wafer technology, although the use of existing semiconductor technology can reduce the size of the micro LED chip, but in the process of achieving ultra-high resolution screen, there will be completely different features from the lighting LED.

When the LED size is smaller than 20um or 10um, the features will drop significantly, unable to guarantee the expected functionality. How to prevent this and achieve (expected functionality) is a challenge.

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