Shulou(Shulou.com)11/24 Report--

CTOnews.com July 11 news, according to the "China Optical Valley" Wechat official account news, recently, Huagong Science and Technology produced China's first 100% localization of the core components of high-end wafer laser cutting equipment, winning a number of China's first in the field of semiconductor laser equipment.

According to Huagong Laser Semiconductor Product Director Huang Wei, the thermal impact and edge collapse width of wafer mechanical cutting is about 20 microns, while the traditional laser is about 10 microns, and after a year of efforts, Huagong Technology's semiconductor wafer cutting technology has been successfully upgraded, the thermal impact is reduced to 0, the edge collapse size is reduced to less than 5 microns, and the cutting line width can be less than 10 microns.

CTOnews.com note: wafer cutting and chip separation, whether mechanical or laser, will cause thermal effects and edge collapse due to material contact and high-speed movement, thus affecting the performance of the chip.

It has been revealed that Huagong Laser is developing the third generation semiconductor wafer laser upgrading and cutting equipment, and plans to launch new products in July this year. At the same time, it is also developing the third generation semiconductor wafer laser annealing equipment with independent intellectual property rights in China.

According to the official website of Huagong Science and Technology, Huagong Science and Technology Industry Co., Ltd. was born out of Huazhong University of Science and Technology, a well-known university in China, and is "the first share of laser in China". At present, it covers the intelligent manufacturing equipment business supported by laser processing technology, optical connection and wireless connection business supported by information and communication technology, and the sensor business pattern supported by sensitive electronic technology, with an industrial base of nearly 2000 mu.

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