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2025-01-16 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)11/24 Report--
Thanks to CTOnews.com netizens for the delivery of clues about the past. CTOnews.com, July 8, 2023 World Semiconductor Congress will be held in Nanjing International Expo Center from July 19 to 21. With the theme of "Core ties, New Future", the conference will bring together global resources and promote the high-quality development of the semiconductor industry.
CTOnews.com learned from the conference's website that Wei Shaojun, academician of the International Eurasian Academy of Sciences and former director of the Institute of Microelectronics of Tsinghua University, Chen Nanxiang, chairman and agent of Changjiang Storage Technology Co., Ltd., Sun Gang, global vice president of Qualcomm, Luo Zhenqiu, general manager of TSMC (China) Co., Ltd., and Shi Lei, president of Tongfu Microelectronics Co., Ltd. Dai Weimin, chairman of Xinyuan Microelectronics (Shanghai) Co., Ltd., and other well-known experts, scholars and entrepreneurs in the semiconductor industry will deliver keynote speeches at the conference.
The conference is co-sponsored by Jiangsu Provincial Department of Industry and Information Technology and Nanjing Jiangbei New area Management Committee. Sadie Consulting Co., Ltd., Jiangsu Semiconductor Industry Association, Nanjing Jiangbei New area Industrial Technology Research and Innovation Park, Nanjing Pukou Economic and technological Development Zone, Nanjing Runzhan International Exhibition Co., Ltd., a total of three main forums, a number of parallel forums and special activities, a professional exhibition.
According to official introduction, the main forum includes the opening ceremony of the conference / summit forum, high-quality development entrepreneur summit, innovation and application summit Parallel forums include the Yangtze River Delta Integrated Circuit Industry Innovation and Development Forum, TSMC customer Conference / supplier Conference, the second Advanced Packaging Innovation Technology Forum, the fourth International third Generation Semiconductor Industry Development Summit Forum, EDA / IP Nuclear Industry Development Forum, Semiconductor Investment and financing Forum, Electronic Gas Safety Symposium, the Seventh Integrated Circuit Talent Development Summit Forum, and the sixth China IC Unicorn Forum. Special activities include "talent" gathering, "core" future-new book press conference, "Jiangbei Night" exchange, the closing ceremony of the conference and China IC Unicorn Salon, etc., and a professional exhibition of 20000 square meters will be held during the conference.
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