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Samsung Electronics DRAM memory and contract manufacturing department performance is low, the person in charge has been replaced

2025-02-14 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

CTOnews.com July 5 news, according to a number of South Korean media reports, Samsung Electronics suddenly changed the head of the contract manufacturing (DS) department and DRAM department in the unconventional personnel season yesterday, which was interpreted as "a means to make up for the poor performance of storage semiconductors in the first half of this year and strengthen the contract manufacturing business."

First, Jegae Jeong, vice president of the technology development department of Samsung's foundry division, was appointed as the top technical head of the division (CTO), and his successor was Jahun Koo.

At the same time, the head of the department responsible for the development of DRAM in storage semiconductors has also been replaced and taken over by Huang Xiangjun (Hwang Sang-jun), who originally served as the vice president of the strategic marketing department, which is interpreted by the industry as a concern for the development of HBM technology.

Currently, the heads of Samsung's senior development, design and strategic marketing departments are You Chang-shik, Oh Tae-young and Yun Ha-ryong, respectively.

In addition, Samsung will set up a new "advanced development team" in the area of device experience (DX) in charge of home appliances and mobile, focusing on future technologies.

In fact, Samsung's management is usually only carried out in the middle of the year, and the sudden restructuring of the two departments may reflect the current difficulties facing the company. At present, Samsung Electronics lags behind TSMC in the contract manufacturing market, and is gradually overtaken by SK Hynix in terms of memory, and it is facing new Chinese enterprises such as Changxin Storage in the future.

South Korean media said that estimates show that Samsung Electronics DRAM production has dropped to the lowest level since the third quarter of 2021, the company in July has cut the average monthly DRAM production to 620000 wafers, a year-on-year decrease of more than 12%. Han Dongxi, a researcher at SK Securities, predicts that "from the third quarter, memory inventory will decline across the board."

Taiwan Economic Daily also believes that after a year of inventory adjustment and the gradual emergence of production reduction effects such as Samsung, the legal person expects DRAM to hit bottom in the third quarter and NAND Flash to hit bottom in the fourth quarter.

It is reported that Samsung Electronics Semiconductor Division (DS) reported an operating loss of 4.58 trillion won (CTOnews.com Note: currently about 25.465 billion yuan) in the first quarter alone and is expected to record a deficit of 3 trillion won in the second quarter.

Samsung Electronics's contract manufacturing market share was 12.4% in the first quarter of this year, down 3.4 percentage points from 15.8% in the previous quarter, according to market research firm Trend Force.

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