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China University of Science and Technology and University of Technology signed an agreement to jointly train high-level chip talents

2025-03-29 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Thanks to CTOnews.com netizen LexPan for the clue delivery! CTOnews.com July 3 news, on the morning of June 28, Hefei University of Technology and University of Science and Technology of China signed a joint training agreement, the two sides will join hands to train high-level chip talents.

CTOnews.com noted that this cooperation is aimed at the major strategic needs of the national integrated circuit industry, which is a strategic, basic and leading industry to support economic and social development and ensure national security, and chip research and development needs strong technology accumulation and talent support.

According to an official press release, the two universities will jointly explore new ways to train innovative talents in integrated circuits and contribute more to the supply of integrated circuit talents and scientific and technological innovation.

According to a report released by @ Hefei, in recent years, the University of Science and Technology of China has actively cooperated with scientific research institutes, well-known universities and enterprises at home and abroad, and is making every effort to train top-notch innovative talents of integrated circuits with solid theoretical and practical experience. As a "double first-class" construction university directly under the Ministry of Education, Hefei University of Technology established the first College of Microelectronics in Anhui University, and was approved to build a national demonstration College of Microelectronics in 2015. it has formed distinct characteristics and dominant disciplines in many fields, such as integrated circuit design, semiconductor devices and integrated technology, electromagnetic field and microwave technology.

At present, there are still some problems in related disciplines, such as the dislocation of academic frontiers and professional courses, the disconnection between talent training and actual needs, and the barrier between universities and enterprises. In this regard, according to the "Joint training Agreement", the two universities will strive to break the boundaries between integrated circuit core disciplines and related disciplines under the cooperation and traction of the national demonstration Institute of Microelectronics. we will jointly establish an innovative mechanism of interdisciplinary integration, industry-education integration, science-education connection, and a new talent training model with zero distance from the practical scene.

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