Shulou(Shulou.com)11/24 Report--

CTOnews.com, June 29 / PRNewswire-FirstCall-Asianet /-- the Belgian Microelectronics Research Center (IMEC) and ASML announced today that they will strengthen their cooperation in the next phase of the development of the most advanced high numerical aperture (High-NA) extreme Ultraviolet (EUV) lithography test line to provide a prototype design platform and untapped future opportunities for industries using semiconductor technology.

The MOU signed today aims to help industries that use semiconductor technology understand the opportunities presented by advanced semiconductor technology and obtain a prototype platform to support their innovation. The collaboration between imec, ASML and other partners will make it possible to explore new semiconductor applications, the possibility of developing sustainable, cutting-edge manufacturing solutions for chipmakers and end users, and the development of advanced overall pattern flows in cooperation with the equipment and material ecosystem.

CTOnews.com learned from an official press release that the MOU signed by the two sides includes all advanced lithography and measurement equipment installed and serving ASML at the IMEC test line in Leuven, Belgium, including the latest 0.55 NA EUV (TWINSCAN EXE:5200), 0.33 NA EUV (TWINSCAN NXE:3800), DUV immersion (TWINSCAN NXT:2100i), Yieldstar optical measurement and HMI multi-beam. This means that the pilot line will be of great value, especially on the advanced pilot line.

Officials say the groundbreaking new NA technology is crucial to the development of high-performance, energy-efficient chips, such as the next generation of AI systems. It also makes possible innovative in-depth technologies that can be used to address some of the major challenges facing our societies, such as health care, nutrition, mobile / automotive, climate change and sustainable energy.

In order to ensure industry-wide access to advanced NA EUV lithography technologies after 2025, significant investment is required and advanced node process R & D capabilities related to Europe are maintained.

According to reports, this MOU initiates the next phase of intensive cooperation between ASML and IMEC on advanced NA EUV. The first phase of process research is being carried out in the imec-ASML Advanced NA Lab using the first Advanced NA EUV Scanner (TWINSCAN EXE:5000).

IMEC and ASML will work with all leading chipmakers, materials and equipment ecosystem partners to prepare the technology for the fastest possible large-scale manufacturing.

In the next phase, these activities will be accelerated on the next-generation Advanced NA EUV Scanner (TWINSCAN EXE:5200) on the IMEC pilot line in Luwen, Belgium.

ASML is making a substantial commitment to IMEC's state-of-the-art pilot plants to support semiconductor research and sustainable innovation in Europe. With the rapid expansion of artificial intelligence (AI) to the fields of natural language processing, computer vision and autonomous systems, the complexity of tasks is increasing. Therefore, it is critical to develop chip technology that can meet these computing needs without exhausting the planet's valuable resources, "said Peter Wennink, President and CEO of ASML.

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