Shulou(Shulou.com)11/24 Report--

CTOnews.com June 28, according to the latest process technology roadmap announced by Samsung OEM (Samsung Foundry) at the annual Samsung OEM Forum (SFF 2023) today, the company plans to launch a 2nm SF2 process in 2025 and a SF1.4 process of 1.4nm in 2027. At the same time, the company also announced some features of the SF2 process.

Samsung's SF2 process is further optimized on the basis of the third-generation 3-nanometer (SF3) process launched earlier this year. Compared with SF3, SF2 technology can improve power efficiency by 25% at the same frequency and complexity, improve performance by 12% with the same power consumption and complexity, and reduce area by 5% with the same performance and complexity. In order to make the SF2 process more competitive, Samsung will also provide a series of advanced IP combinations for the process, including LPDDR5x, HBM3P, PCIe Gen6 and 112G SerDes.

Following SF2, Samsung will launch SF2P optimized for high performance computing (HPC) in 2026 and SF2A process optimized for automotive applications in 2027. Also in 2027, the company plans to start mass production using the SF1.4 (1.4nm) manufacturing process. Samsung's 2nm process will be roughly in sync with TSMC's N2 (2nm) process, about a year later than Intel's 20A process.

CTOnews.com noted that in addition to continuously improving its own process technology, Samsung OEM plans to continue to develop its RF technology. The company expects its 5-nanometer RF technology to be ready in the first half of 2025, and Samsung's 5-nm RF process is expected to increase power efficiency by 40% and transistor density by about 50% compared to the old 14-nm RF process. In addition, Samsung will begin producing gallium nitride (GaN) power semiconductors in 2025 for a variety of applications in consumer goods, data centers and automobiles.

In terms of expanding the technology supply, Samsung OEM remains committed to expanding its manufacturing capacity in Pyeongtaek, South Korea and Taylor, Texas, USA. Samsung plans to start mass production of chips on its Pingze No. 3 production line (P3) in the second half of 2023. The new plant in Taylor is expected to be completed by the end of this year and begin operation in the second half of 2024. Samsung's current plan is to increase its clean room capacity by 7.3 times that of 2021 by 2027.

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