Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues on the way! CTOnews.com June 25 news, Intel recently announced internal restructuring, responsible for chip manufacturing and contract manufacturing IFS department will operate independently, Intel hopes that its manufacturing department will become the world's second largest wafer foundry next year. In this regard, Lu Xingzhi, a well-known semiconductor analyst, said that after waiting for 10 years, Intel finally announced that it would split the Ah Dou that it could not afford.

▲ source: Intel Lu Xingzhi said in the article that although Intel has split its wafer and manufacturing divisions, it will, as always, emphasize the technological leadership of TSMC on its PPT in order to save face. Lu Xingzhi believes that after Intel completely gets rid of the burden of wafer manufacturing, CEO Kissinger is bound to lead the chip design department rather than the manufacturing department. In this way, the delay in the process by 2025 has nothing to do with it.

▲ source: Intel CTOnews.com collates the views of Lu Xing's article as follows:

Intel IDM2.0 model will completely split its manufacturing division IFS and design department, IFS will be transformed into pure wafer generation factory.

Intel's break-up of IFS will save $3 billion in costs (CTOnews.com Note: currently about RMB 21.57 billion) and increase profit margins by 6 per cent. Intel chips are expected to save $80 billion (currently about 71.9 billion yuan) by 2025, and Intel chips will be commissioned by lower-cost outside manufacturers. This can save testing and mass production costs, improve capacity utilization, and the split IFS department can also focus on reducing manufacturing costs.

Intel will place more orders for external foundry than IFS department, otherwise it will lose the meaning of splitting IFS department.

Intel's operating margin was 33% in the quarter and is expected to grow to 40% in the third quarter. Lu Xing speculated that the profit margin of Intel's IFS division, which is responsible for chip manufacturing and foundry, is-28%. He stressed that Intel's IFS division had lost its price competitiveness and that it was difficult to invest 30% of its annual operating income as capital expenditure as TSMC did.

Intel will accelerate the split of chip contract manufacturing and manufacturing divisions within two years, reducing its stake to less than 50%. The US government will become the "catcher". Lu Xingzhi said that Intel's chip manufacturing division can return to the industry average only after at least 4-5 years of restructuring and layoffs.

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