Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, June 21 (Xinhua)-- Micron announced its first UFS 4.0-compliant memory chip on Wednesday local time. According to reports, the smartphone equipped with this module is expected to become the fastest device so far.

Micron expects some of its flagship smartphones, tablets and ultra-low-power laptops to use its UFS 4.0module this year. In addition to providing higher performance than the previous generation, the new generation of products has also achieved a 25% improvement in energy efficiency.

According to reports, Meguiar UFS 4.0 provides three kinds of capacity-256GB, 512GB and 1TB focus, and works with Meguiar's own master.

Among them, the high-end 512 GB and 1 TB products use 232layer 1Tb 3D TLC NAND hexagonal particles, which can provide 4300 MB/s sequential read speed and 4000 MB/s sequential write speed, which is by far the highest performance smartphone UFS enclosure. This is also the first six-plane architecture NAND) particles.

Based on the data provided by Micron, the 256GB chip is slightly slower than the 512GB and 1TB models because it uses four-sided 3D NAND particles.

The Micron UFS 4.0 enclosure uses two M-PHY Gear 5 channels for data transmission and supports proprietary firmware features such as Data Stream Separation, Auto Read Burst, and Eye Monitoring.

Mark Monteyer, vice president and general manager of Micron Mobile's business unit, said: "Micron's latest mobile solution combines our industry-leading UFS 4.0 technology, proprietary low power controller, layer 232 NAND and highly configurable firmware architecture to provide unparalleled performance."

Thanks to the high capacity of 232 layers of 3D TLC NAND particles. Meguiar UFS 4.0module is very thin. The company says its z height is no more than 0. 8-0.9mm, which will allow handset makers to make their products thinner or hold higher-capacity batteries.

Meguiar is currently providing samples of its UFS 4.0s to major smartphone makers and expects these products to begin mass production and use in various terminal models in the second half of this year, officials said.

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