Shulou(Shulou.com)11/24 Report--

CTOnews.com June 8, TSMC today announced the official opening of its advanced closed test plant 6, which is the first All-in-one automated closed test plant to integrate pre-and post-stage processes and tests. This will lay the foundation for mass production of the TSMC-SoIC process, TSMC said.

▲ drawing source: TSMC

TSMC said in a statement that the advanced closed test plant will enable the company to have more complete and flexible production capacity of 3D Fabric advanced packaging and silicon stacking technologies such as SoIC, InFO, CoWoS, and bring higher comprehensive efficiency to production yield and product performance.

According to reports, in order to support the next generation of high-performance computing, artificial intelligence and mobile devices, TSMC began to build an advanced closed testing plant No. 6 in 2020, which is located in Zhunan Science Park and covers an area of 14.3 hectares. It is TSMC's largest closed test plant.

TSMC pointed out that the clean room area of this plant is larger than that of all other TSMC packaging plants combined, and it is expected that it can handle more than 1 million 300mm wafers per year, and the annual test service time will exceed 10 million hours. Previously, due to a serious shortage of advanced packaging capacity, TSMC squeezed a large number of orders from GPU suppliers such as Nvidia.

CTOnews.com noted that the plant's five-in-one intelligent automated material handling system has a total length of more than 32 kilometers, uses artificial intelligence technology to simultaneously perform precise process control, has 500 times the data processing capacity per second of the former fab, and has established a complete product traceability, with each chip having a complete production traceability.

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