Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com June 8 news, SK Hynix issued an announcement today (June 8), announcing the start of mass production of 238 layer 4D NAND flash memory.

SK Hynix said in the announcement that it has begun mass production of 238 layers of 4D NAND flash memory and is conducting product verification with overseas customer companies that make smartphones.

SK Hynix stressed: "based on 238 layers of NAND flash memory, the company has successfully developed client-side SSD (Client SSD) solutions for smartphones and PC, and began mass production in May. The company's products on the 176th floor and even the 238th layer ensure the world's top competitiveness in terms of cost, performance and quality, and expect these products to improve the company's performance in the second half of the year."

According to reports, 238 layers of NAND flash memory, as the smallest chip in the world, has increased its production efficiency by 34% compared with the previous generation of 176layers. This product has a data transfer speed of 2.4Gb per second, which claims to be 50% faster than the previous generation, and has improved read and write performance by about 20%.

SK Hynix said it plans to first supply 238 layers of NAND flash memory to mobile products after completing the verification of the smartphone customer company, and then expand its application to PC solid state drives (SSD) based on PCIe 5.0 and data center-class high-capacity solid-state drive products.

The 96-layer NAND flash memory developed by SK Hynix in 2018 introduced 4D mode, using charge capture technology (CTF,Charge Trap Flash) and PUC (Peri. Under Cell) technology. Compared with 3D, 4D architecture claims to have the advantages of smaller unit area and higher production efficiency.

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