Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com June 1 news, Kioxia recently released the latest generation of UFS 4.0 flash memory chip, a total of 256GB, 512GB and 1TB three specifications. The armor said samples of 256GB and 512GB chips will be shipped this month, while samples of 1TB chips will be delivered in October.

Armor said that the next generation of UFS 4.0storage uses a compact design and can be used in a variety of mobile devices such as flagship smartphones. In addition, the new flash memory chip is expected to improve the efficiency of 5G technology, improve download speed and reduce data transmission delay.

According to the JEDEC standard, CTOnews.com quoted the official press release of UFS 4.0. it encapsulates the innovative BiCS FLASH 3D memory chip and master, supports MIPI M-PHY 5.0 and UniPro 2.0 interfaces, and achieves theoretical throughput of up to 23.2Gbps per channel and 46.4Gbps per chip. The company also points out that UFS 4.0 storage is backward compatible with UFS 3.1.

The main feature of the next generation UFS 4.0 flash memory chip is that the sequential write speed is 18% faster than that of the previous generation UFS flash chip, the random write speed is 30% faster, and the read speed is 13% faster.

Shepherd said that by supporting High Speed Link Startup Sequence, the connection speed between the flash chip and its installation device has been increased to 1248 Mbit / s. Armor's UFS 4.0chip also provides multi-loop queuing support and enhanced RMPB interface to improve throughput and data protection.

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