Shulou(Shulou.com)11/24 Report--

CTOnews.com, May 29 (Xinhua)-- Japanese precision parts manufacturer Orbray has announced that it has signed an agreement with Toyota's automotive semiconductor research and development company Mirise Technologies to jointly develop diamond power semiconductors, according to the Nippon Industry News.

▲ source: Obray reported that Mirise and Orbray will combine their diamond wafer substrate and power element technology to jointly develop vertical diamond power components to meet the needs of electric vehicles. Among them, Orbray will be responsible for developing P-type conductive diamond wafer substrates, while Mirise Technologies will develop continuous voltage-withstanding structures in power components.

According to the report, the two sides signed a three-year cooperation agreement. Diamond power semiconductors are expected to be practical in 10 years' time. Orbray will invest 10 billion yen (CTOnews.com Note: currently about 503 million yuan) to build a new factory producing products such as diamond wafer substrates for vehicle power semiconductors, and electric vehicle components such as ECU will also be mass-produced there.

CTOnews.com access information that, compared with the traditional silicon, SiC, GaN and other third-generation semiconductor materials, diamond has a better resistance to high voltage characteristics, higher thermal conductivity that is heat dissipation performance. Therefore, experts believe that diamonds are the best fourth-generation semiconductor materials.

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