Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for clue delivery! CTOnews.com May 26 news, Weigang has announced that at the end of this month, Taipei Computer Show 2023 will showcase a new generation of notebook memory standards-CAMM memory module.

As shown above, on the left is the CXL (Compute Express Link) memory module for servers, which expands memory capacity up to 16TB and increases hardware constraints and optimizes costs for AI and HPC.

The upper right is CAMM (Compression Attached Memory Module) memory, which is 57% thinner than traditional notebook memory module SO-DIMM, which can effectively reduce power consumption and improve heat dissipation effect. It is suitable for laptops, small industrial computers, etc.

The DDR5 8400 MR-DIMM memory is at the bottom right. Using dual rank memory modules with the latest generation of Data Buffer will double the data transfer capacity and accelerate the overall operation efficiency of the memory module.

As CTOnews.com reported earlier this year, Tom Schnell, a JEDEC committee member and Dell senior engineer, said JEDEC is working on a new notebook memory specification to replace the SO-DIMM memory standard that has been in use for 25 years. Dell originally built the CAMM memory design, which was first used on the Precision 7770 mobile workstation. JEDEC's CAMM standards will be based on Dell CAMM designs, and final specifications may vary.

The first JEDEC CAMM memory modules should be available when SO-DIMM memory reaches 6400 MT / s, thus replacing SO-DIMM.

Source Dell

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