Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues on the way! CTOnews.com, May 23, according to the report at the ITF World 2023 meeting, Ann Kelleher, general manager of Intel Technology Development, introduced Intel's latest progress in key areas. One of them is to introduce the stackable CFET transistor architecture that Intel will adopt in the future. This is the first time that Intel has introduced this new transistor design to the public. At the meeting, Intel outlined the general development path of its transistor technology, that is, it evolved in the order of "Planar FET planar FETs", "FinFET fin FETs (current mainstream)", "RibbonFET full-surround gate FETs" and "CFET stacked FETs", but did not mention a specific date or timetable for mass production.

▲ source ITF World 2023 Intel's GAA design stackable CFET transistor architecture, developed with the help of imec, is designed to increase transistor density by stacking n and p MOS devices on top of each other and allowing the stacking of eight nanowires (twice as many as the four nanowires used by RibbonFET). Intel is currently working on two types of CFET, including monolithic and sequential, but has not yet decided which one will eventually be adopted, or whether other types of designs will emerge, and more details should be released in the future.

▲ Picture Source ITF World 2023 previously in the 2021 "Intel accelerated Innovation: process process and Packaging Technology online Conference", Intel has confirmed that RibbonFET will be a history, in its 20A process, will introduce the use of Gate All Around (GAA) design RibbonFET transistor architecture to replace the FinFET transistor architecture launched since 2011. The new technology will speed up the switching speed of the transistor and achieve the same driving current as the multi-fin structure, but take up less space.

▲ map source IMEC is worth noting that Intel's roadmap and its CFET architecture are not proposed independently, but the result of a long-term cooperation with IMEC institutions. CTOnews.com Note: IMEC, whose full name is "Interuniversity Microelectronics Centre" Microelectronics Research Center, is an important organization in the chip industry on a par with TSMC and ASML. This organization combines semiconductor design software (EDA) companies such as Intel, TSMC, Samsung and ASML, Applied Materials, Cadence and Synopsys to conduct future semiconductor technology research.

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