Shulou(Shulou.com)11/24 Report--

CTOnews.com, May 18, 5G L-PAMiD Module (LNA-Power Amplifier Module integrated Duplexer) is a RF front-end module integrated with power amplifiers, low noise amplifiers, couplers, RF switches, filters, duplex / multiplexers, etc., which can not only support the transceiver requirements of 5G band, but also downwards compatible with 4G, 3G and 2G bands, and support 5G+4G dual connection requirements of most frequency bands.

The L-PAMiD chips developed by domestic RF front-end chip design companies Weijiechuangxin and Anruiwei have entered the stage of mass production and have been verified by many brand customers. It is expected to achieve mass production in 2023.

With regard to the progress of WiFi FEM, Wei Chuangxin said that the company's mainstream products are Wi-Fi 6 and Wi-Fi 6e, which are mainly used in mobile phones and routers, and have achieved large-scale mass production; at the same time, WiFi 7 products will be launched this year, which have been sent and promoted on the client side.

According to Yole data, in 2022, the global RF front-end market reached US $19.2 billion (CTOnews.com Note: currently about 134.016 billion yuan), while the 5G RF power amplifier module achieved business income of 888.5956 million yuan in 2022, accounting for 44.32% of the company's RF power amplifier module revenue.

Since the 5G era entered in 2019, terminals such as smart phones have put forward higher requirements for RF front-end devices in terms of communication frequency, number of frequency bands, channel bandwidth, carrier aggregation and so on. Under the trend of communication standard upgrade, the RF front end of smart phone is developing in the direction of modularization. 5G RF front-end module, including L-PAMiD, L-PAMiF, L-FEM, LNA BANK, MMMB, TxM and so on.

At present, foreign giants such as Sijiaxun, Qualcomm, Broadcom, QORVO and other companies have mass-produced 5G L-PAMiD modules as early as 2021, while domestic manufacturers have mass-produced 5G RF front-end modules such as L-PAMiF, L-FEM, LNA BANK, MMMB, TxM, etc., but 5G L-PAMiD has not been mass-produced by domestic manufacturers.

The mass production of Weijiechuangxin L-PAMiD chip means that the domestic RF front-end chip 5G L-PAMiD chip has achieved a zero breakthrough.

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