Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens, soft media Xinyou 1957189, Mr. Aviation for the delivery of clues! CTOnews.com May 16 news, semiconductor device supplier Zhaoyi Innovation announced the launch of 3mm × 3mm × 0.4mm FO-USON8 package of SPI NOR Flash--GD25LE128EXH, the maximum thickness of only 0.4mm, capacity up to 128Mb. At present, the mainstream package of 128Mb capacity products in the industry is 6mm × 5mm × 0.8mm WSON8,GD25LE128EXH, which is the smallest plastic package product that can be realized in this capacity.

CTOnews.com learned from the official that the GD25LE series SPI NOR Flash is the flagship low-power product of Zhaoyi Innovation. The GD25LE128EXH continues the performance of the LE series, with the highest clock frequency 133MHz and data throughput of 532Mbit/s, improving system access speed and boot efficiency. In 4-channel 133MHz, the read power consumption is only 6mA, which is 45% lower than that of similar products.

According to the official introduction, GD25LE128EXH is pin-compatible with 3mm × 4mm × 0.6mm USON8 packaging products with 64Mb and less capacity, and there is no need to adjust the PCB layout. The same series of 3mm × 2mm × 0.4mm FO-USON8 packaging products, GD25LE64E, will provide samples at the end of May.

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