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TSMC: 2nm production in 2025, the technology will lead the world

2025-02-28 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Brother Black fly's left hand clue delivery! CTOnews.com May 11 news, according to Taiwan's "Central News Agency" news, TSMC 3nm mass production last year, 2nm is expected to mass production of 2025, TSMC business development senior deputy general manager Zhang Xiaoqiang said that TSMC 3nm is the world's leading technology, 2nm mass production will also lead the world.

TSMC held the 2023 Taiwan Technology Forum today. Zhang Zongsheng, deputy general manager of TSMC Advanced Technology and Optical Mask Project, said that in order to meet customer demand, TSMC has rapidly and steadily increased the production capacity of 7 nm, 5 nm and 3 nm advanced processes. it is estimated that the compound growth rate will reach 40% from 2019 to 2023.

Zhang Zongsheng pointed out that the improvement of the good rate of 5 nanometers is better than that of 7 nanometers in the same period. at present, 3 nanometers are produced in large quantities, and the yield will soon be as good as 5 nanometers.

Zhang Xiaoqiang said that customers are quite satisfied with TSMC's 5nm process. At present, the 3nm process is stable. Mobile phones and high-efficiency computing customers are actively promoting the use of 3nm process, with an enthusiastic degree of more than 5nm.

Zhang Xiaoqiang said that automotive customers are also eager to promote 3nm process technology, TSMC to provide N3AE solutions for customer design and use, will help customers shorten the time to market for two to three years. According to the needs of different application customers, TSMC will launch N3P and N3X processes in the future.

Considering that special processes are also very important to customers, TSMC has synchronously expanded its special process capacity. Zhang Zongsheng pointed out that the annual compound growth rate of special process capacity from 2019 to 2023 is about 10%, accounting for 54% of mature processes from 2019 to 67% in 2023.

Zhang Zongsheng said that TSMC is also actively expanding the advanced packaging capacity of 3D Fabric, and the clean room area is expected to increase to more than twice the size of 2021 by 2025.

TSMC will build an average of two new plants a year from 2017 to 2019, six in 2020, seven in 2021 and three in 2022, and two more will be built this year, Mr Zhang said.

In addition, TSMC is actively expanding its global production base. Zhang Zongsheng pointed out that three of Nanke Wafer 18 plants will be 3 nm production bases, and the Bamboo Wafer 20 plant began to build last year and is expected to produce 2 nm in 2025. Taichung's new 2 nm plant is expected to start building in 2024.

Zhang Zongsheng said that two plants will be built at the wafer 21 plant in Arizona, the first plant is expected to produce 4 nanometers in 2024, and the second plant is under construction. Japan's wafer 23 plant is expected to produce a special process in 2024.

CTOnews.com noted that Korea Economic Daily reported a few days ago that Samsung's semiconductor industry director Kyung Kwai-hsien said that Samsung's chip process technology will surpass TSMC in the next five years. Zhang Xiaoqiang did not comment on the opponent, saying that TSMC leads the world with 3 nanometers, and 2 nanometers will be the world's leading technology when it is mass-produced in 2025.

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