Shulou(Shulou.com)11/24 Report--

CTOnews.com May 9 news, according to MSI, after engineers' continuous optimization of the motherboard and memory, the recent AM5 platform motherboards such as X670 and B650 of MSI have optimized the mainstream Hynix A DIE particles and M DIE particles.

According to reports, there is a High Efficiency mode efficient mode under the overclocking interface of BIOS, in which the Memory Timing Preset option is selected, which is divided into four levels, and you can choose the appropriate option according to your own particle characteristics.

Take MPGX670E CARBON WIFI Diablo as an example, use Hynix A DIE granule memory, FCLK 2100 Magi UCLK synchronization, and select the Tightest option on the setting. When enabled, the read and write speed is increased by 16% and 20% respectively, and the latency is reduced from 61.7ns to 57.1, indicating that the memory performance has been effectively improved when the frequency is all 6400MHz.

In addition to Hynix A DIE particles, the memory of Hynix M DIE particles has also been improved after measurement, with an increase of 15.8% in reading and 11.5% in writing.

The above functions are achieved through BIOS updates, and players in need can experience them by updating the latest version of BIOS.

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