Shulou(Shulou.com)11/24 Report--

CTOnews.com, May 6, TSMC said in its annual report to shareholders that despite the overall slowdown in the semiconductor industry in 2022, the company's shipments of 12-inch equivalent wafers reached 1530 million wafers, an increase of 7.7 percent over the same period last year.

Wafers of advanced chip manufacturing technology (less than 7 nanometers) account for 53% of the total combination, compared with 50% in 2021. Overall, TSMC shipments accounted for 30% of all non-memory semiconductor products in the world, an increase of 4 percentage points.

TSMC said it is moving into the 2nm process (N2) and plans to enter risk production (risk production) in 2024 and mass production in 2025.

TSMC executives said in an earnings call that TSMC still has the most advanced semiconductor technology in the industry in terms of density and energy efficiency.

The performance of semiconductors produced by the N3E process will be improved by 15%, while the performance of the N2 process will be improved by 30%. CTOnews.com Note: N3E is an upgraded version of TSMC's 3nm node, and the company plans to start mass production of the technology in the second half of this year.

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