Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Xiao Zhan for the clue delivery! According to CTOnews.com, April 21, Marvell Technology has made a chip indirect port module with high speed and high bandwidth using TSMC 3nm process.

Many technologies including 112G XSR SerDes (Serializer / Deserializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0SerDes and 240Tbps Parallel Interconnect are used in the manufacturing process of the module.

The CTOnews.com has the following chart, in which the blue line on the left represents the high-performance signal of PCIe Gen 6 / CXL 3.0 optimized 3nm SerDes, and the orange line on the right represents the low-latency 3nm SerDes signal optimized by 112G XSR.

The parallel connection speed between chips can reach 240 Tbps, which is 45% faster than the available alternatives for multi-chip applications. Although the transmission distance is only a few millimeters or less, 10,000 high-definition movies can be downloaded per second.

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