Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com April 12, Intel said that its chip manufacturing division (IFS) has reached a partnership with British chip designer Arm to ensure that mobile phone chips and other products using Arm technology can be produced in Intel factories.

As part of Intel's IDM 2. 0 strategy, the company is investing globally, including massive expansion in the US and EU. This partnership will provide more balanced global supply chain support for OEM customers working on mobile SoC designs on Arm-based CPU kernels.

By unlocking Arm's leading computing portfolio and world-class IP,Arm partners based on Intel process technology, they will be able to take full advantage of Intel's open system foundry model that goes beyond traditional wafer manufacturing, including packaging, software and small chips.

According to reports, the cooperation will first focus on mobile SoC design, but allow potential designs to be extended to automobiles, the Internet of things (IoT), data centers, aerospace and government applications.

Arm customers designing next-generation mobile SoC will benefit from leading Intel 18A process technology, which provides new breakthrough transistor technology to improve power and performance, as well as IFS's strong manufacturing footprint, including capacity in the United States and the European Union.

"everything is digitally driven and the demand for computing power is growing, but so far, fab customers have limited options to design around the most advanced mobile technologies," said Pat Gelsinger, Intel's chief executive. "Intel's partnership with Arm will expand market opportunities for IFS and open up new options and methods for any fab company that wants to gain the power of first-class CPU IP and open system foundry with leading process technology."

IFS and Arm will conduct Design Technology Collaborative Optimization (DTCO), in which chip design and process technology are optimized together to improve the power, performance, area and cost (PPAC) of the Arm core for Intel 18A process technology.

CTOnews.com learned officially that the Intel 18A introduced two breakthrough technologies, the PowerVia for optimized power transmission and the RibbonFET surround gate (GAA) transistor architecture for optimizing performance and power.

IFS and Arm will develop mobile reference designs to showcase software and system knowledge for contract manufacturing customers, officials said. As the industry evolves from DTCO to system Technology Collaborative Optimization (STCO), Arm and IFS will work together to leverage Intel's unique open systems contract manufacturing model to optimize platforms from "applications and software" to "packaging and silicon".

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