Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Xiao Zhan for the clue delivery! CTOnews.com, April 8, 2023 China Hebi Information Technology Independent Innovation Summit Forum was officially held today, at which Zhang GE, vice president of Godson Zhongke Technology Co., Ltd., released a new high-performance server processor-- Godson 3D5000.

Godson 3D5000, which encapsulates two 3C5000 wafers together through chiplet technology, is a 32-core CPU product for the server market, according to Godson.

Godson 3D5000 integrates 32 high-performance LA464 processor cores with frequency 2.0GHz, supports dynamic frequency and voltage regulation, integrates 64MB on-chip L3 shared cache and 8 72-bit DDR 3200 memory controllers, supports ECC verification, and is equipped with 5 HT 3.0high-speed interfaces to support self-research bridge chip and two-way and four-way CPU expansion.

In addition, the Godson 3D5000 also integrates a secure trusted module project, with a SPEC 2006 score of more than 425.The double-precision floating-point performance can reach 1TFLOPS, which is four times the core performance of a typical ARM.

It is worth mentioning that Godson 3D5000 uses Godson independent instruction set LoongArch, which has the characteristics of super computing power and excellent performance, and does not need foreign authorization, and can meet the computing needs of general computing, large-scale data center and cloud computing center. The launch of Godson 3D5000 also marks that Godson Zhongke has entered the domestic leading ranks in the field of server CPU chips.

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