Shulou(Shulou.com)11/24 Report--

CTOnews.com, March 31 (Xinhua)-- Huawei today released its annual report for 2022, which shows that Huawei's overall operation is stable, with global sales revenue of 642.3 billion yuan up 0.9% year-on-year, and net profit of 35.6 billion yuan down 68.7% from the same period last year. Facing the future, Huawei continues to increase its R & D investment, reaching 161.5 billion yuan in 2022, accounting for 25.1% of the annual income, and the cumulative R & D expenditure over the past decade has exceeded 977.3 billion yuan.

Xu Zhijun, chairman of Huawei, and Meng Wanzhou, CFO of Huawei, attended the press conference of Huawei's 2022 annual report.

Xu Zhijun, chairman of Huawei, said that Huawei and its partners have realized the localization of EDA tools above 14nm, which means that any domestic semiconductor company can use domestic EDA tools to design chips of more than 14nm. The domestic semiconductor industry has been subject to sanctions in recent years, but it is believed that China's semiconductor industry will be reborn in the sanctions and achieve self-reliance.

At the Huawei hardware and software tools oath meeting at the end of February, Huawei rotating Chairman Xu Zhijun said that Huawei chip design EDA tools team EDA enterprises within the United Nations have jointly created EDA tools for the above 14nm process, basically realized the localization of EDA tools above 14nm, and will complete their comprehensive verification in 2023.

Xu Zhijun said: over the past three years, we have worked hard to build our tools around the three R & D production lines of hardware development, software development and chip development, and completed the replacement of 78 tools for software / hardware development, ensuring the continuity of R & D operations.

In the integrated circuit industry chain, electronic design automation (CTOnews.com Note: EDA) is the upstream and core basic technology. EDA provides automation-aided design capabilities for integrated circuit design, manufacturing and packaging industries, integrating many cutting-edge technologies such as microelectronics, computational mathematics, graphics and artificial intelligence.

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