Shulou(Shulou.com)11/24 Report--

CTOnews.com March 21 news, according to the "Tsinghua Department" chip company Arctic Xiongxin news, recently, academician Yao Qizhi of Tsinghua University on behalf of China's Chiplet Industry Alliance, IP manufacturers inside and outside the United Nations, domestic leading packaging manufacturers, domestic leading systems and application manufacturers jointly released the "Core Interconnection Interface Standard"-Advanced Cost-driven Chiplet Interface (ACC), which is led by the Institute of Cross-Information Core Technology. Jointly drafted by China Chiplet Industry Alliance. At present, the standard involves relevant group standards and industry standards are under application.

According to reports, the "Core Interconnection Interface Standard" ACC 1.0 standard is a high-speed serial port standard, which is optimized based on domestic packaging and substrate supply chain, with cost control and commercial rationality as the core.

According to previous reports from CTOnews.com, ten global giants such as Intel, AMD and TSMC established the UCIe Alliance in 2022 to provide core-particle interconnection standards with up to 32G bandwidth, which are suitable for 2.5D and 3D advanced packaging (such as Intel EMIB, TSMC CoWoS, etc.).

The Core Interconnection Interface Standard (ACC) issued by China Chiplet Industry Alliance is a high-speed serial port standard with a bandwidth of more than 32G, focusing on the optimization and applicability of domestic substrate and packaging supply chain system, as well as cost control.

The difference between the applicability of the two mainly lies in the industry areas they face and the acceptable cost structure of the end-user scenario: in the field of pursuing ultra-high performance computing, although the production cost of advanced packaging required by UCIe may account for 60%, 70% or more of the total cost of the chip, small area core interconnection can effectively solve the pain point of yield of large area chip in advanced process. In the case of large shipments, it has higher commercial value. In many downstream areas where costs are sensitive, shipments are limited, supply chain capacity is weak and supply requirements are high, the adoption of ACC standards can better meet the needs of commercial feasibility.

At present, the mainstream semiconductor giants at home and abroad have internal interconnection standards adopted according to their own product needs, but they are not authorized to be used openly. The ACC standard issued by China Chiplet Industry Alliance is to comply with the development trend of the industry, take commercial landing as the main goal, and finally achieve wide market use and promotion through differentiated technical advantages and attractive licensing prices.

Unlike UCIe, which is based on global supply chain and advanced packaging, ACC standard is optimized at the interface level based on domestic substrate and packaging capability, and takes cost control as the main entry point. ACC standard has promoted the research and development of relevant enterprises within the alliance, and relevant enterprises will launch corresponding interface products based on ACC standard in the near future, so as to promote heterogeneous integration solutions based on Chiplet, so as to solve the common pain points in domestic SoC market, such as long development cycle, high risk, slow iteration, large investment and so on.

From the perspective of application field, ACC standard is more suitable for all kinds of heterogeneous computing scenarios, such as all kinds of AI acceleration products, GPU, FPGA, multi-core CPU Die and so on. For the Coherence interaction scenarios where the data flow is unpredictable in multiple single-core CPU interconnections, the delay of the ACC standard has a great impact on the overall performance.

ACC 1.0standard: click here to download (PDF)

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