Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens South China Daniel Wu, Xiao Zhan cut, kinja clue delivery! CTOnews.com, March 18 / PRNewswire-FirstCall-Asianet /-- SK Hynix (SK Hynix) recently announced the details of the eighth generation 3D NAND with more than 300 stacked layers, which is expected to be available in late 2024 or early 2025.

CTOnews.com learned from the SK Hynix official announcement that the eighth generation 3D NAND stack matured more than 300 layers with a capacity of 1Tb (128GB), with three-level units and a bit density (bit density) exceeding 20Gb / mm ^ 2.

The chip has a page capacity (page size) of 16KB, has 4 planes, the interface transmission speed is 2400MT / s, and the highest throughput is 194MB/s (18% faster than the 7th generation 238 layer 3D NAND).

The nearly doubling of the bit density of the new NAND means that it will significantly increase the per wafer productivity of the new manufacturing nodes and reduce the cost of SK Hynix, although the exact extent is not clear.

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