Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com, March 15 (Xinhua)-- Google has decided to hold an I / O 2023 developer conference on May 10, and is expected to launch many new products, including the Pixel 8 series. Foreign media SmartPrix joined hands with reliable source OnLeaks to share the high-definition rendering of Pixel 8 Pro mobile phones.

According to the report, Google has made a number of detailed adjustments to the appearance of the Pixel 8 Pro. First, the edges of the phone are more rounded, and the rear camera has changed from a horizontal exclamation point to three cameras concentrated in an oval area.

CTOnews.com also noticed from the rendering that there is a new sensor under the flash on the right side of the back of the fuselage, but the exact function is not yet clear. Media SmartPrix speculates that it could be a macro or depth sensor, or an entirely new sensor technology.

The front of the Pixel 8 Pro fuselage is equipped with a 6.52inch screen, the size of the fuselage is 162.6 × 76.5x8.7mm, and the thickness of the raised part is 12mm.

The bottom of the machine uses USB Type-C port, the right side is the power and volume button, and the left side is the SIM card tray. There is also Google's LOGO on the back of the body.

In the specification, the Pixel 8 Pro will use the Tensor G3 chip. The chip is based on the unreleased Samsung Exynos 2300 processor and is mass-produced using Samsung's 3nm node technology. Since the current Google Tensor G2 chipset is based on 5nm technology, the implementation of the Tensor G3 chipset may improve both performance and efficiency.

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