Shulou(Shulou.com)11/24 Report--

CTOnews.com March 14 news, recently, a notice circulated on the Internet, Huawei announced that it has successfully developed a chip stacking technology solution. In addition, there are rumors that Huawei's chip stacking scheme, which can achieve 7nm level in the 14nm process, belongs to the curve to save the country.

Huawei responded to the notice as a fake and a rumor, according to Sina Technology.

CTOnews.com noted that in May last year, Huawei Technology Co., Ltd. published a patent for "chip stack packaging structure and its packaging method and electronic equipment". According to the patent summary, the application relates to the field of electronic technology, which is used to solve the problem of how to reliably bond multiple sub-chip stack units to the same main chip stack unit.

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