Shulou(Shulou.com)11/24 Report--

CTOnews.com March 13 news, Canon today launched a new semiconductor lithography machine for the previous process, the I-line step lithography machine "FPA-5550iX", which can achieve 0.5 μ m (micron) high resolution and 50 × 50mm large field of view exposure at the same time.

According to reports, the new product "FPA-5550iX" can achieve 50 × 50mm large field of view and 0.5 μ m high resolution exposure at the same time, which makes it possible to achieve high resolution imaging under a single exposure in the manufacturing field of high-precision full-frame CMOS sensors.

At the same time, by making full use of the advantages of high resolution and large field of view, "FPA-5550iX" can also be used in the exposure process of small display devices such as head-mounted displays.

In addition, with the increasing demand for advanced XR device displays, the product can also be widely used in the manufacture of miniature OLED displays with large field of view and high contrast.

The new product "FPA-5550iX" can not only be used in semiconductor device manufacturing, but also play its role in more extensive device manufacturing fields, such as the most advanced XR device display manufacturing.

In addition, the "FPA-5550iX" alignment oscilloscope not only has the function of "bright field detection" to detect direct light, but also adds the function of "dark field detection" to detect scattered light and diffracted light. Users can choose the corresponding detection methods according to their needs. Through the expansion of the range of optional wavelengths, the application of regional sensors, and the ability to carry out multi-pixel measurement, the detection effect of lower noise can be achieved, even if it is a low-contrast alignment mark. It can also be applied to the measurement of all kinds of alignment marks to strengthen the ability to support users' various processes. For example, as an optional function, users can choose to be equipped with far-infrared wavelengths that can penetrate the silicon wafer to align and measure the back of the wafer during the manufacture of the backlit sensor.

CTOnews.com Note: the alignment oscilloscope is a microscope that can read and align the alignment marks on the wafer. The principle is to illuminate the light from the alignment light source to the alignment mark, pass through the lens, and detect the light on the area sensor.

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