Shulou(Shulou.com)11/24 Report--

CTOnews.com March 13, DRAM giants such as Samsung Electronics and SK Hynix are accelerating the commercialization of 3D DRAM, but it is far less than Micron (starting from 2019 to conduct 3D DRAM research, the number of patents obtained by the two companies is 2-3 times that of the two companies).

On the 12th, the Korean semiconductor industry reported that the main semiconductor leaders of Samsung Electronics and SK Hynix recently said at the semiconductor conference that they would accelerate the commercialization of 3D DRAM. They believe that 3D DRAM is a way to overcome the physical limitations of DRAM.

At the "IEEE EDTM 2023" held at the Sanchong-dong Korea Trade Center in Gangnam District, Seoul, Lee Jong-Ming, vice president of Samsung Electronics Semiconductor Research Institute and head of the process development room, said: "3D DRAM is considered to be the future growth driver of the semiconductor industry."

In addition, Che Shanlong, deputy general manager of SK Hynix Future Technology Research Institute, also said: "the details of the electronic features of 3D DRAM will be released next year to determine the direction of development."

Image source Pixabay3D DRAM is a kind of memory chip with brand-new structure. To put it simply, the focus of the existing DRAM product development is to increase the density by reducing the circuit width, but as the linewidth enters the 10nm range, the industry begins to face physical limitations such as capacitor leakage and interference. In order to avoid or weaken this effect, the industry has introduced new materials and equipment such as high dielectric constant (high K) deposition materials and extreme ultraviolet (EUV) equipment. But the semiconductor industry believes that small chips that make 10nm or more advanced chips will pose huge challenges for manufacturers.

Samsung Electronics and SK Hynix have mass-produced high-end DRAM lines of 12 nanometers this year. Considering the situation that the linewidth of DRAM will be reduced to 1nm at present, the industry thinks that the commercialization of new DRAM in 3 ~ 4 years will be a necessity, not a direction.

Of course, unlike the existing DRAM market, as far as CTOnews.com knows, there is no absolute leader in the 3D DRAM market, so rapid mass production is crucial. With the activity of artificial intelligence applications such as ChatGPT, the industry also begins to increase the demand for high-performance, high-capacity storage semiconductors.

I believe that as Samsung Electronics and SK Hynix begin to accelerate the commercialization of 3D DRAM technology, we will have more and even Chinese manufacturers to launch similar technical solutions and products in the future.

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