Shulou(Shulou.com)11/24 Report--

CTOnews.com, March 9, according to BusinessKorea, Samsung Electronics has hired Lin Jun-Cheng, former R & D director of TSMC, as vice president of the semiconductor department's advanced packaging business team, thus promoting the development of Samsung's advanced packaging technology.

According to reports, Lin Jun is a senior expert in the field of semiconductor packaging. He worked in TSMC for 19 years (from 1999 to 2017), during which he co-ordinated more than 450 core patents registered by TSMC in the United States, laying the foundation for TSMC's current proud 3D packaging technology.

Before joining TSMC, he worked for Micron Technology, an American storage semiconductor company, for several years. CTOnews.com also found that before joining Samsung Electronics, he was the CEO of semiconductor equipment company Skytech, with deep experience in packaging equipment production.

Compared with global semiconductor companies such as TSMC and Intel, Samsung Electronics has invested late in advanced packaging. However, since last year, the South Korean chipmaker has been actively building packaging infrastructure and recruiting talent.

Last year, Samsung Electronics set up a working group on the commercialization of advanced packaging directly led by Kyung Kye-hyun, president of DS. This year, the working group was upgraded to a standing Advanced Packaging Business Group, directly led by Vice President King Moon-soo. Before hiring Lin Juncheng, Samsung Electronics had poached Jin Yuping from Apple and appointed him as head of the US Packaging Solutions Center.

In addition, Samsung Electronics' wafer foundry division hired Lee Sang-Hun, vice president of advanced lithography technology, and Benny Katibian, who developed self-driving car semiconductor solutions for Qualcomm, from Intel. In addition, Lee Jong-suk, executive director of Samsung Electronics'MX division in charge of smartphones, also moved from Apple to Samsung Electronics this year.

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