Shulou(Shulou.com)11/24 Report--

CTOnews.com March 7, AMD recently participated in the International Conference on solid State Circuits (ISSCC) and shared die shot photos of cIOD (the naked chip of the I / O interface) on the Zen 4 processor in a presentation.

A die shot is a photograph or record of an integrated circuit layout that shows its internal design after all packages have been removed. The die shot diagram is used to compare the bare chip with the cross section of a two-dimensional computer chip, on which the design and construction of various tracks and components can be clearly seen.

Foreign professional netizen Locuza also provided detailed notes on this photo. However, the picture released this time is not much of a surprise. The Zen 4 cIOD includes a RDNA 2 WGP that contains four 40-bits DDR5 memory channels.

CTOnews.com learned from foreign media HotHardWare reports that Zen 4 cIOD shows that the chip has two GMI3 ports. GMI3 is the interface used to connect CCD (the Core Complex Dice that hosts the Zen 4 kernel) to cIOD. This means that you cannot use your existing cIOD to handle more than two CCD, contrary to past rumors that AMD is considering such a processor.

The Zen 4 cIOD actually has only 28 PCIe 5 channels, compared with 32 channels on previous generations of chips, but only 28 are active. This may indicate that AMD is very confident in the maturity of the 6nm process that makes cIOD.

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