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Lenovo Wang Huiwen: low temperature solder paste process is the general trend of the industry

2025-03-28 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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On March 3, at the media meeting on the production line of cryogenic solder paste technology, Wang Huiwen, vice president of Lenovo Group and chief quality officer of computers and intelligent devices, said that with the increasing integration of chips and thinner motherboards, the adoption of cryogenic solder paste technology will be the general trend of the electronic products manufacturing industry, as the world's largest private brand PC equipment manufacturing leader. Lenovo is willing to open this technology to all manufacturers free of charge to jointly promote the green and sustainable development of the industry.

Advanced standard system to ensure the quality of products

In recent years, due to the popularity of high-performance computing and artificial intelligence calculus, facing the requirements of high efficiency and high bandwidth, low power consumption, multi-chip integration and spatial integration equipment, the low-temperature welding process with low-temperature solder and lead-free has become the focus of public attention.

Low temperature solder paste welding is a standardized and mature process widely recognized by the world.

As a widely recognized process of standardized alloy content, low-temperature tin paste was recognized and promoted by the International Electronic Industry components Association, the Japanese Industrial Standards Organization and the International Organization for Standardization as early as 2006. In 2017, Lenovo's production and R & D base Lianbao Technology took the lead in introducing low-temperature solder paste welding process into the production line, and all production lines are compatible with welding technology that supports both high-temperature and low-temperature solder paste.

Wang Huiwen said that at present, 45 million notebooks using low-temperature solder paste process produced by Lianbao Technology have been shipped to more than 180 countries and regions around the world, and so far there have been no reports of quality problems caused by this process. On the one hand, this proves the maturity of low temperature solder paste technology, on the other hand, it also comes from Lenovo's harsh product quality system.

"quality has always been Lenovo's lifeline." Wang Huiwen stressed that in terms of quality management, Lenovo follows the concept of "focusing on customers, standard guidance, source prevention, intelligent drive and ecological win-win", from end to end of the whole product life cycle. a set of effective quality management system has been established to ensure every product of Lenovo from project establishment to development to production and delivery to customers. Every link has strict quality standards.

Wang Huiwen also said that among the computer components, Lenovo has a perfect traceability system to establish ecological quality management for more than 1,000 upstream suppliers to ensure good quality. At the same time, in recent years, Lenovo has also made full use of digital and intelligent means to achieve digital visual management and intelligent decision support, which have created conditions for the excellent quality of low-temperature solder paste welding products.

Moreover, in order to fully demonstrate the reliability of low-temperature solder paste, chip slices using low-temperature solder paste welding technology will be placed under hundreds of thousands of times microscope to see whether the chip element structure is stable, solder joint cracking and micro-morphological changes. through repeated experiments to ensure the quality of low-temperature solder paste welding.

Wang Huiwen stressed that the use of low-temperature solder paste, like motherboards with other welding materials, has to undergo dozens of stringent tests, such as PCBA board-level tests, such as 85 degrees Celsius + 85% high temperature and humidity test, rapid temperature change test from minus 40 degrees Celsius to above zero 85 degrees Celsius, 125 degrees Celsius test and machine vibration, shock, distortion and other tests, which are severe tests for welding technology.

At the same time, Lenovo Lianbao Factory, as one of the few laboratories certified by CNAS, its test standards and test data are higher than national and international standards, and will reach mutual recognition with other laboratories internationally. " After thousands of stringent tests and layers of stringent industry standards, it has been proved that the low-temperature solder paste process has withstood the test, and its safety and reliability are self-evident, and whether it is low-temperature welding or room temperature welding, Lenovo's quality standards for all products are strictly consistent, and there is no question of being treated differently according to different processes. " Wang Huiwen said.

Lianbao Technology has one of the few laboratories certified by CNAS in the country.

The general trend of green and low carbon development of low temperature tin paste

At a time when the country is moving towards the "3060" double carbon goal, the green environmental protection concept and action of PC equipment is also particularly important.

As a pioneer in implementing the low-carbon concept in the global ICT industry, Lenovo innovatively carried out the research and application of low-temperature solder paste welding process as early as 2015, focusing on solving the "three high" problems from the manufacturing source. In 2021, Lenovo has shipped 14.3 million laptops made with the new low-temperature solder paste process, with a total shipment of 45 million since 2017, successfully reducing 10, 000 tons of carbon dioxide emissions.

Wang Huiwen believes that low-temperature solder paste welding has significant advantages in reducing energy consumption and carbon emissions in the welding process of electronic products, and has become an important solution for energy saving and emission reduction in the manufacturing industry, and has been more and more recognized by the industry in recent years. It is a more advanced welding technology derived from the development of technology to a certain stage.

Low temperature solder paste welding has become an important technology in energy saving and emission reduction in manufacturing industry.

Since 2021, Lenovo has listed ESG, technological innovation and service transformation as its three major strategies, taking the lead in completing the closed-loop practice of carbon reduction from the top-level goal and strategy of net zero emissions to the whole product life cycle. Lenovo promises to reduce greenhouse gas emissions by 1 million tons in the global supply chain by 2025, reduce operational direct and indirect carbon emissions by 50 percent by 2030, reduce carbon intensity in some value chains by 25 percent, and achieve net zero emissions by the end of 2050.

Meanwhile, at the end of 2022, Mingsheng MSCI, the world's largest index company, upgraded Lenovo Group (00992) ESG to AAA, the highest rating in the world. All of these mean that, as a pathfinder and leader of ESG, Lenovo has always been actively driving the development of supply chain ESG, exporting intelligent solutions to promote the green transformation of various industries and promoting high-quality economic and social development, and low-temperature welding process is a key measure on Lenovo's carbon-saving road.

Low temperature solder paste welding process is a key measure on Lenovo's carbon saving road.

Wang Huiwen said that the low-temperature solder paste welding process not only ensures the quality of Lenovo's products, but also "shows its skills" in reducing carbon and emissions. Low temperature solder paste welding process can save up to 25% energy in practice, which is of great significance not only from the point of view of quality, environmental protection, but also from the development trend of the future process.

According to the forecast of the International Federation of Electronic Manufacturers (iNEMI), by 2027, the market share of products using low-temperature welding process will increase to more than 20%, and low-temperature welding process will become a new trend of electronic products welding process. At the same time, the low-temperature solder paste welding process also expands more design freedom and imagination space for more product integration, and will become a catalytic converter to promote the innovation of integrated circuit industry and promote the development of green and low carbon.

"after thousands of experiments, Lenovo has made low-temperature solder paste welding, an industry-leading and green innovative process, as Lenovo's core technology. by continuously promoting green, low-carbon, safe and reliable process innovation, Lenovo will actively promote carbon neutrality, help slow global warming, and work together to create a more environmentally friendly and sustainable green future." Wang Huiwen said.

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