Shulou(Shulou.com)11/24 Report--

CTOnews.com March 1 news, Changdian Technology recently announced that it will provide 4D millimeter wave radar advanced packaging production solutions to more customers to meet the increasingly diversified customized development and technical service needs of automotive electronics customers.

High-precision vehicle millimeter wave radar is widely used in adaptive cruise control, blind spot detection, automatic emergency braking system and other fields. It is an important part of the perception layer that provides safety for vehicles. Reliable advanced packaging solutions for high-precision millimeter wave radar are indispensable in ensuring the functionality and reliability of chip microsystems.

At present, the advanced packaging schemes used in millimeter wave radar products are flip (FCCSP) and fan out (eWLB). Long Power Technology has complete advanced packaging technology solutions in both FCCSP and eWLB. For SOC system chip products with integrated antenna AiP (CTOnews.com Note: all referred to as Antenna in Package), long Power Technology also has reliable solutions. The fan-out eWLB scheme uses RDL to form the circuit, which has lower parasitic resistance, thinner thickness and lower cost than the substrate.

Long Electric Technology said that for millimeter wave radar transceiver chip MMIC,eWLB packaging scheme occupies a dominant position; for integrated millimeter wave radar transceiver, digital / radar signal processing and other functions of SOC chips, vehicle application scenarios for product performance, grade and heat dissipation and other different requirements make eWLB and FCCSP packaging parallel development; for millimeter wave radar SOC chips with integrated antennas, FCCSP is a more suitable package choice.

The 4D millimeter wave radar advanced packaging production solution of Changdian Technology eWLB and FCCSP can meet the development needs of customers' self-driving at and above L3 level, realizing high performance, miniaturization, easy installation and low cost. Changdian Technology also cooperates with international well-known customers to develop smaller Antenna on Mold and double-sided RDL packaging solutions.

EWLB package Development Roadmap Changdian Technology has covered many application fields such as intelligent cockpit, ADAS, sensors and power devices in the field of automotive electronics. In the high-precision vehicle millimeter wave radar market, Changdian Technology cooperates with a number of millimeter wave radar chip customers at home and abroad to meet the needs of multiple transceiver channels, integrated antennas and low power consumption in eWLB and FC flip packaging. At present, Changdian Technology has achieved large-scale mass production of vehicle specification millimeter wave radar products, and has entered the mass production models of many terminal automobile brands.

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