Shulou(Shulou.com)11/24 Report--

CTOnews.com February 27, Samsung Electric announced that it has developed an automotive semiconductor substrate (FCBGA,Flip Chip-Ball Grid Array) for advanced driving assistance system (ADAS), expanding the product lineup of semiconductor substrates for high-end cars. Samsung Electric plans to supply this product to customers around the world.

Samsung said the newly developed FCBGA can be applied to high-performance self-driving systems and is one of the most technologically advanced products in automotive electronics.

▲ source: Samsung Motor, it is reported that the width and spacing of the circuit lines in this newly developed substrate have been reduced by 20%, and it has achieved more than 10000 bumps in limited space (see figure below for what is a bump), so you can design semiconductors with higher density, and the performance and efficiency of chips based on this substrate will be improved. In addition, it solves reliability issues, including improving bending strength to deal with multi-chip packages in which multiple chips are installed on a single substrate at the same time.

CTOnews.com popular science: FC-BGA packaging can provide better electrical characteristics, and greatly increase the pin density, reduce interference, improve heat dissipation performance, but also reduce the package size to meet the needs of high-end products and high-performance products. Chip bump is one of the key components of FC interconnection structure, which has three main functions: forming electrical connection between chip and substrate, forming structural connection between chip and substrate, and providing heat dissipation for chip.

Samsung Electric said the new product has been certified by AEC-Q100, a standard for reliability testing of automotive electronic components, and can be used in everything from body and chassis to infotainment and self-driving.

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