Shulou(Shulou.com)11/24 Report--

According to news on February 24, Wang Kai, vice president of Dreambloom Technology, revealed that the next generation of new hybrid reality MR flagship will be launched in April this year, while Apple will unveil its MR on WWDC in June.

Wang Kai said, "in terms of the scale of users, the average daily use of adventure equipment is 85 minutes, the number of weekly active users is up to 6 days, and the monthly operating rate is 91%."

Wang Kai said that adventure has been able to build its own full stack of technical capabilities and barriers from underlying algorithms to application interaction in the whole cycle of layout XR. In the next few years, Adventure will continue to create differentiated value for users in the three directions of products, business models and ecological strategies. Specific to the technical route, Adventure 2023 full-line products will support MR function.

He pointed out that VR is currently in the process of rapid evolution to MR. Compared with VR devices, MR can break its sense of blocking, through the perspective of the camera, the perfect combination of content and real environment, and really achieve the natural interaction between virtual content and real content. At the same time, the newly upgraded interaction mode can also provide a wide range of imagination space for application development and game design. "neither VR nor AR can carry the visual and interactive requirements of metacosmos. We believe that MR, which integrates VR and AR, will become the mainstream form of metasmological XR general terminals in the future."

Wang Kai revealed that Adventure's flagship MR product will be released in April this year. From the exposed product pictures, Adventure's new generation of MR flagship has adopted a lightweight design. The shape of the front face of the host is obviously different from the existing models in the market, and "thinning" may become one of the main selling points of the product, which also means that it may be improved in terms of hardware configuration, host material, battery loading, heat dissipation and so on.

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