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The monthly production capacity of TSMC's 3nm process is gradually increased, and is expected to reach 45000 wafers next month.

2025-01-19 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

February 24 news, according to foreign media reports, after Samsung Electronics adopted the 3nm process with full-surround gate transistor architecture for mass production, TSMC still adopted the 3nm process for fin field effect transistors, and officially began commercial production on December 29 last year.

According to the latest foreign media reports, like TSMC's previous process, the production capacity of the mass-produced 3nm process in December last year is also gradually increasing, and the monthly production capacity will reach 45000 wafers next month.

According to the report, Apple booked the full capacity at the initial stage of mass production of TSMC's 3nm process. Referring to the monthly capacity of TSMC's process, it said it would reach 45000 wafers next month.

However, even if the production capacity of TSMC's 3nm process is increasing, the production capacity of this process will still be tight this year.

In a conference call with earnings analysts last month, Wei Zhijia, CEO of TSMC, mentioned that their customers' demand for the 3nm process exceeded their supply capacity, and they expected the production capacity of the process to be fully utilized this year.

Wei Zhijia also mentioned the revenue of the 3nm process at the meeting at that time. He said that they expected to bring them considerable revenue from the third quarter of this year, accounting for a medium single digit of the annual revenue. It is expected that the revenue this year will be higher than that in the first year of mass production of the 5nm process, that is, 2020.

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