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CTOnews.com, February 23 (Xinhua)-- AMD has officially announced that it will expand support for the growing ecosystem of 5G partners, from core to radio access network (RAN) applications, and release new 5G products while providing additional new testing capabilities. AMD's wireless telecommunications partner ecosystem has more than doubled in the past year, thanks to the integration of AMD and Sailings product lines and the establishment of a new telecom solution test lab in partnership with VIAVI.

Telecom solution Test Lab the establishment of Telecom solution Test Lab is critical for operators and telecom solution providers to test, validate and expand computing resources to meet the growing demand from RAN to edge-to-core (edge-to-core). The test lab supports verification of end-to-end solutions from hardware to software to take advantage of the latest AMD processors, adaptive SoC, SmartNIC, FPGA, and DPU.

To support this project, the VIAVI end-to-end test suite can analyze, develop and verify the impact of the actual operation of the entire telecommunications network through the network test solutions it provides. The Telecom solution Test Lab will use current and future AMD technologies to simulate and generate traffic across core, CU / DU, edge and RAN to conduct comprehensive functional and performance testing and meet current and future intergenerational ecosystem needs. The Telecom Solutions Test Lab, based in Santa Clara, California, will introduce the first 5G ecosystem partners in the second quarter of 2023.

The widespread adoption of new Zynq UltraScale+ RFSoC devices 4G / 5G AMD Zynq UltraScale+ RFSoC and MPSoc radio technology for the emerging 4G / 5G growth market can provide support for the design of new integrated remote radio units. AMD is expanding its Zynq UltraScale+ RFSoC digital front-end (DFE) portfolio with two new products: Zynq UltraScale+ RFSoC ZU63DR and Zynq UltraScale+ RFSoC ZU64DR devices. These new RFSoC models will drive the expansion and deployment of 4G / 5G radios to global markets that require low-cost, low-power, and high-spectrum efficiency radios to meet the growing demand for wireless connectivity.

AMD said it will showcase O-RAN-based remote radio units designed for open interfaces using AMD Zynq UltraScale+ RFSoC and MPSoC. The new AMD Zynq UltraScale+ RFSoC is cost-effective and energy efficient, making it ideal for global emerging markets, including rural and outdoor deployments.

Zynq UltraScale+ RFSoC ZU63DR is designed for 4T4R (4 transmit and 4 receive) technology and dual-band entry-level O-RAN radio unit (O-RU) applications. Zynq UltraScale+ RFSoC ZU64DR is designed for 8T8R (8 transmit and 8 receive) O-RU applications with the third Generation partner Program (3GPP) split-8 option and can support both non-traditional and traditional radio unit architectures.

Both RFSoC devices use the deep DFE integration technology of Zynq UltraScale+ RFSoC ZU67DR's flagship devices and are expected to be fully operational in the second quarter of 2023. AMD will showcase its Zynq UltraScale+ RFSoC DFE series at the upcoming MWC 2023 in Barcelona.

CTOnews.com learned from the official that the AMD booth is located in Hall 2 of the MWC Congress, 2M61, and the exhibition will be held from February 24 to March 2, 2023.

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