Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Xiao Zhan for the clue delivery! CTOnews.com February 21 news, in the field of logic, memory, CMOS sensors and other cutting-edge semiconductors, the manufacturing process is becoming more and more complex. Semiconductor components manufacturers need to improve the accuracy of engraving in order to produce high-precision semiconductor components, so there are more and more alignment measurement points to be measured before exposure.

If a large number of measuring points are aligned in the semiconductor lithography machine, the measurement itself will be very time-consuming, which will reduce the production efficiency of the semiconductor lithography machine. For this reason, the wafer measuring machine is introduced into the semiconductor manufacturing field to separate the alignment measurement function of the semiconductor lithography machine, so as to ensure the high precision and efficiency of production.

On February 21, Canon launched the wafer measuring machine "MS-001" for semiconductor manufacturing, which can carry out high-precision alignment measurement of wafers.

According to ▲ MS-001, the alignment oscilloscope carried by "MS-001" is equipped with a region sensor, which can carry out multi-pixel measurement and reduce the noise during measurement. In addition, "MS-001" can also measure many kinds of alignment marks.

By using the newly developed alignment oscilloscope light source, the wavelength range of the new product is 1.5 times larger than that of semiconductor lithography equipment, and can be aligned and measured at any wavelength required by the user. Therefore, compared with the measurement in semiconductor lithography equipment, the alignment measurement accuracy that can be achieved by "MS-001" is higher.

▲ increased alignment marking (schematic) Canon said that with the application of new products, most of the alignment measurement can be completed before the wafer is transported to semiconductor lithography equipment, reducing the workload of alignment measurement operation in semiconductor lithography equipment, thereby improving the production efficiency of semiconductor lithography equipment.

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