Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen Xiao Zhan for the clue delivery! CTOnews.com February 15, Qualcomm announced the launch of Snapdragon X755G modem and RF system, which is also the world's first "5G Advanced-ready" baseband product that supports ten-carrier aggregation and promises 10Gbps downlink speeds in Wi-Fi 7 and 5G. 5G Advanced-ready, which is between 5G and 6G, is also known as "5.5G" in the industry, which will achieve better results in the upgrading of XR field, vehicle networking, 5G uplink communication capability and so on. The Snapdragon X75 is currently in production, and commercial terminals are expected to be released in the second half of 2023. Snapdragon X75's technology and innovation empower OEM vendors to create next-generation experiences across segments, including smartphones, mobile broadband, automotive, computing, industrial Internet of things, fixed wireless access (FWA) and 5G enterprise private networks.

The Qualcomm Snapdragon X75 modem is the official follow-up to the Snapdragon X70 modem launched in 2022 and is expected to be used in Snapdragon 8 Gen 3 smartphones. The modem offers a number of upgrades, the most striking of which is a 20% increase in energy efficiency.

CTOnews.com learned that the new modem includes full-band support from 600MHz to 41GHz. In this baseband chip, millimeter wave mmWave hardware (QTM565) is integrated with Sub-6 hardware. This puts all 5G connections on one module. Qualcomm says this provides easier manufacturing, reducing the physical area of some chips by 25%. In addition, putting mmWave / Sub-6 on a single chip can achieve up to 20 per cent more energy efficiency than the X70. The new QTM565 millimeter wave antenna module is matched with a converged transceiver, reducing cost, circuit board complexity, hardware occupancy and energy consumption. On this basis, Qualcomm's 5G PowerSave Gen 4 and its RF efficiency kit are also committed to further extending battery life.

In other ways, the artificial intelligence of the chip has also been greatly enhanced. The Snapdragon X75 is also the first modem system with a dedicated hardware tensor accelerator. Compared with the first generation of chips in last year's X70, the second generation of Qualcomm 5G artificial intelligence processors promises to increase AI performance by 2.5 times, which means that the best frequency can be selected more intelligently to achieve the best connection. Qualcomm claims that due to the use of GNSS positioning Gen 2, the positioning accuracy has been improved by 50%. This not only reduces power consumption, but also improves the stability of the connection. This complements the choice of new second-generation intelligent networks.

Qualcomm said the Snapdragon X75 will be released along with the next generation of flagship chips, suggesting it will be a Snapdragon 8 Gen 3 chip. Worldwide, the Snapdragon X75 baseband is expected to be used in flagship phones such as the Samsung Galaxy S24 series.

Snapdragon X75

The Snapdragon X75 uses a new scalable modem-to-antenna architecture built for scalability and delivers excellent 5G performance, with key features including:

The world's first ten-carrier aggregation for millimeter wave band, the world's first Sub-6GHz-band downlink five-carrier aggregation, and FDD uplink MIMO, thus supporting excellent spectrum aggregation and capacity.

The integrated RF transceiver for millimeter wave and Sub-6GHz band, coupled with the new fifth generation Qualcomm QTM565 millimeter wave antenna module, can reduce cost, circuit board complexity and power consumption, and reduce hardware board area.

Qualcomm's Advanced Modem and RF Software Suite (Qualcomm Advanced Modem-RF Software Suite) further improves the continuous performance of user scenarios, including elevators, subways, airports, parking lots and games.

AI-based sensor-assisted millimeter wave beam management achieves excellent connection reliability and improves AI enhanced positioning accuracy.

The fourth-generation Qualcomm 5G PowerSave and Qualcomm RF Energy efficiency Suite (Qualcomm RF Power Efficiency Suite) can extend battery life.

The second generation Qualcomm DSDA supports the use of 5G / 4G dual data connections on two SIM cards at the same time.

The fourth generation of Qualcomm Smart Transmit can facilitate fast, reliable and long-distance upload, and it also includes support for Snapdragon Satellite.

In addition to Snapdragon X755G modems and RF systems, Qualcomm Technologies announced the release of Snapdragon X725G modems and RF systems, a 5G modem-to-antenna solution optimized for the mainstream market of mobile broadband applications, supporting download and upload speeds of thousands of megabits.

The third generation Qualcomm fixed wireless access platform

The third generation Qualcomm fixed wireless access platform with Snapdragon X75 is the world's first fully integrated 5G Advanced-ready fixed wireless access platform, which supports not only millimeter wave and Sub-6GHz, but also Wi-Fi 7 and 10Gb Ethernet capabilities.

The new platform delivers excellent performance with quad-core CPU and dedicated hardware acceleration designed to support peak performance across 5G cellular, Ethernet, and Wi-Fi. With the above enhancements, the third-generation Qualcomm fixed wireless access platform will support a new type of all-wireless broadband, providing thousands of megabits of transmission speed and wired low latency for almost all terminals in the home. In addition, the third-generation Qualcomm fixed wireless access platform will help provide mobile operators with a wide range of applications and value-added services. and provide them with cost-efficient deployment-providing fiber-optic Internet speeds to rural, suburban and densely populated urban communities through 5G wireless networks, promote the global popularity of fixed wireless access and further narrow the digital divide.

In addition to the functions brought by the Snapdragon X75, the key features of the third-generation Qualcomm fixed wireless access platform include:

The hardware architecture that combines millimeter wave and Sub-6GHz will reduce board footprint, reduce cost, board complexity and power consumption.

The second generation Qualcomm dynamic antenna control can enhance the self-installation function.

Qualcomm RF sensor kit can support indoor millimeter wave CPE deployment.

Qualcomm tri-band Wi-Fi 7 supports up to 320MHz channels and professional multi-connection operation, bringing ultra-fast, reliable, low-latency connections, as well as mesh network features for seamless network coverage.

Flexible software architecture supports a variety of frameworks, including OpenWRT and RDK-B.

Through dual SIM cards, the third-generation Qualcomm fixed wireless access platform supports 5G dual-card dual-pass (DSDA) and dual-card dual standby (DSDS) configurations.

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