Shulou(Shulou.com)11/24 Report--

CTOnews.com January 31 news, according to South Korean media The Elec reported that LG Innotek located in Gyeongsangbei City, South Korea FC-BGA factory recently held the first machine entry ceremony, the company president Jung Chul-dong and a number of senior executives attended.

The plant will begin mass production of flip-chip ball grid array (FC-BGA) substrates in the second half of this year, which will be used in Apple's M-series processors in the future, LG Innotek said in a press release.

CTOnews.com small class:

FC-BGA (Flip Chip-Ball Grid Array) substrate is a high-density semiconductor packaging substrate which can realize the high-speed and multi-function of LSI chips. Letterpress uses the original development of micro-machining technology and laminated wiring board technology to develop ultra-high-density wiring structure substrate to provide products that support the micro-refinement needs of semiconductor processes.

The new FC-BGA plant plans to build a mass production system in the first half of the year and begin full production in the second half of the year. It will be built into an intelligent factory that integrates the latest digital transformation technologies such as artificial intelligence, robots, unmanned, intelligence, and so on.

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