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CTOnews.com, January 18 / PRNewswire-FirstCall-Asianet /-- Texas Instruments (TI) today introduced advanced specialty semiconductors using ultrasonic lens cleaning (ULC) technology, enabling camera systems to quickly detect and use tiny vibrations to remove dirt, ice and water.

In the past, removing contaminants from the camera lens required manual cleaning, which could lead to system downtime or the use of a variety of mechanical devices, which could fail. TI's new ULC chipset, which includes the ULC1001 Digital signal processor (DSP) and the accompanying DRV2901 piezoelectric transducer driver, uses a proprietary technology that allows the camera to quickly remove contaminants on its own using precisely controlled vibration to quickly remove debris, thereby improving system accuracy and reducing maintenance requirements. The chipset provides designers with a compact and cost-effective way to use ULC in a variety of applications and camera sizes.

Avi Yashar, product marketing engineer at TI, said: "ULC can make the widespread use of self-cleaning cameras and sensors a reality. Existing cleaning methods are costly and impractical, requiring complex mechanisms, expensive electronic equipment and a large number of treatments to detect pollutants and perform cleaning. With the continuous development of applications ranging from car and traffic cameras to smart cities and manufacturing, there is an urgent need for a simple and cost-effective way to achieve self-cleaning cameras. "

The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, temperature and fault detection without any image processing, making ULC technology extremely adaptable for a variety of camera lens designs. The small size of the chipset makes it possible to improve machine vision and sensing in a variety of applications, anywhere the camera or sensor can get dirty.

Using TI's ULC chipset, there is no need for complex mechanical devices or human intervention in the lens cleaning system. ULC1001 Ultrasonic cleaning DSP with proprietary algorithms integrates pulse width modulators, current and voltage detection amplifiers, and analog-to-digital converters. TI's chipset, used in conjunction with the DRV2901 piezoelectric transducer driver as a companion amplifier, enables ULC in a compact package with a printed circuit board size smaller than 25mm x 15mm, thereby reducing the bill of materials while providing more functionality than a discrete vertical implementation.

CTOnews.com has learned that ULC1001 DSP has begun mass production and can be purchased on TI.com and through authorized distributors in 4.5mm x 4.5mm, 32-pin HotRod Quad Flat No-Lead (QFN) packages. DRV2901 piezoelectric transducer drivers are now available on the market and are now available for complete reel, TI.com and other channels.

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