Shulou(Shulou.com)11/24 Report--

CTOnews.com news on January 16, TSMC President Wei Zhe Jia confirmed for the first time at a news conference on the 12th that TSMC is considering building its second plant in Japan.

TSMC is building a wafer fab with special process technology in Japan, which will use 12max 16nm and 22max 28nm process technology and is scheduled to go into mass production by the end of 2024, Mr Wei said. TSMC is also considering building a second fab in Japan, as long as customer demand and the level of government support are reasonable, he said.

Mr Wei also said that in Europe, TSMC was in contact with customers and partners to assess the possibility of building special-process fabs focused on automotive technology based on customer needs and the level of support from local governments.

CTOnews.com learned that in December last year, TSMC announced that it would increase its planned investment of $12 billion to $40 billion to build two plants in Phoenix, Arizona, with plans to produce 4nm and 3nm chips in 2024 and 2026, respectively.

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