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Jiang Bolong debuts in CES 2023 | looking at the new trend of storage from the perspective of technology trend.

2025-03-04 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

From January 5 to 8, local time in the United States, the International Consumer Electronics Exhibition (CES2023) was held in Las Vegas, Nevada, USA, bringing together all kinds of cutting-edge technologies and products, causing widespread concern in the science and technology circle.

Memory as an important part of scientific and technological products, naturally can not miss this technological "kaleidoscope". Follow in Jiang Bolong's footsteps and catch a glimpse of CES 2023.

(CES 2023 Live)

PC storage: Gen4, Low-Power

In the field of PC, AMD held a keynote speech at CES 2023. The core focus of this speech is naturally the release of the AMD Auron 7000 series of mobile processors. This series of processors are divided into multi-generation Zen architecture, multiple processes and multiple product lines in parallel. Among them, the 7035 series and 7030 series with high performance and high integration support LPDDR5 and LPDDR4 memory respectively in RAM, while ROM is the whole series marching into the PCIe Gen4 SSD era, and their main applications point to high-performance ultra-thin notebooks, except that they have higher clock frequency than the previous generation. Low-power design can bring excellent energy efficiency and battery life performance at the same time, it can be expected that the popularity of PCIe Gen4 SSD and on board LPDDR in ultra-thin notebooks will grow rapidly.

For ultra-thin notebooks, the industry storage brand FORESEE brought two PCIe Gen4 SSD, LPDDR5, XP2100 and XP2000, at the exhibition, and many people in the industry favored the design of high performance, security and low power consumption.

(FORESEE ultra-thin notebook storage scheme)

It is worth mentioning that Xintian Technology's Robo&Kala 2 in 1 notebook computer was officially released and exhibited on the same stage with Jiang Bolong's storage products. According to the public information on the spot, the laptop uses the 5nm Snapdragon 8cx Gen 3 platform, and the storage is equipped with PCIe Gen4 SSD and LPDDR4x, which is the mainstream high-performance laptop configuration at present. Xintian Technology and Jiang Bolong have always maintained a good cooperative relationship, and the two sides will further strengthen cooperation in the PCIe Gen4 SSD of 1TB / 2TB M.2 2230 in the future.

(official launch of Robo&Kala 2 in 1 laptop)

Smartphone storage: UFS, High-Capacity

In terms of smartphones, CES gathered at the scene, and what attracted much attention was that Motorola announced its upcoming smartphone, the ThinkPhone. According to the release specification, the ThinkPhone will carry Qualcomm Snapdragon 8 Gen2 SoC,RAM up to 12GB Gen2 SoC,RAM, which is aligned with the new smartphone products released by major mobile phone manufacturers in recent months-starting with 128GB capacity and complying with the current high-capacity market trend.

According to the analysis of CFM flash memory market data, with the slowing down of the replacement frequency of consumers after the 5G replacement wave, the service life of mobile phones is greatly extended, and the amount of data is increasing day by day, which makes consumers' demand for high-capacity mobile phones more intense. At present, the mainstream storage capacity of smart phones is 256GB to 512GB, and the memory capacity is from 6GB to 8GB. It is expected that in the next few years, the mainstream mobile phone storage scheme will gradually transition from eMMC to high-capacity, high-performance UFS, and the memory will be dominated by LPDDR5 with lower power consumption.

FORESEE, whether from separate storage solutions (eMMC, UFS&LPDDR4x / 5) or integrated storage solutions (eMCP4x / uMCP), provides smart phones with more options to improve performance and capacity, helping mobile phone manufacturers to quickly switch storage solutions.

(FORESEE mobile phone storage solution)

Smart car storage: VR, Vehicle-Mounted

Netizens jokingly called CES a "car show", with cars and transportation technologies accounting for "half of the country" in CES, in which in-car electronics became the focus of competition. It can be seen at the scene that the use scene of smart cars is changing. Innovative vehicle technologies such as digital emotional interaction, VR driving and cloud game services can not only achieve basic functions such as navigation and driving assistance, but also provide users with entrances such as meta-universe and game entertainment, making it convenient for users to enter the virtual world directly in the car.

Automobile manufacturers will combine virtual reality technology with intelligent cars as the next step, and they need to greatly improve their computing power. Data processing will not only stay in the cloud server, but the demand for local storage will also increase significantly, which will undoubtedly drive large-capacity eMMC, UFS, SSD and other markets.

In recent years, FORESEE has made great efforts to develop automotive storage and successively developed specification-grade eMMC / UFS products, which work at wide temperature, erase and write life, durability and stability all meet the AEC-Q100 reliability standards. With Jiang Bolong's self-developed firmware, it can cover a variety of high-end automotive application scenarios, and has entered many automotive mainframe manufacturers.

(FORESEE Automotive Storage Scheme)

Smart wearable / Home Storage: Intelligent, Subsize

In addition to the new products and technology releases of smartphones, PC and smart cars, we can also feel the innovative areas of smart wear and smart home, terminal devices such as olfactory VR devices, somatosensory vests, wireless power security cameras and baby intelligent ecological kits are all equipped with highly integrated microchips, and some devices also reserve storage card slots to facilitate external expansion of practical applications. An endless stream of intelligent terminals with integrated software and hardware have added new vitality to CES2023.

(FORESEE smart wearable / home storage solution)

Longsys:Stability 、 Enterprise Data

CES can see many innovative devices that provide low latency for real-time processing of massive data based on 5G, AI applications and meta-universe concepts. Behind these device terminals are IT devices based on servers, cloud computing or cloud distributed storage to provide uninterrupted services. The Longsys enterprise eSSD and RDIMM released by Jiang Bolong a few days ago are the key storage components with high performance and high reliability as the basic requirements.

(Longsys enterprise data storage solution)

Lexar:Gaming 、 High-Performance

The international high-end consumer storage brand Lexar (Rexa) stood out in CES 2023, bringing high-performance storage products such as NM800PRO M.2 2280 PCIe Gen4x4 NVMe solid state drives, ARES RGB DDR5 UDIMM desktop computer memory, PLAY microSDXC ™UHS-I memory cards, Lexar ®SL660 BLAZE removable solid state drives and other high-performance storage products for the game e-sports market. In terms of image cards, Lexar still maintains a "fine tradition". The DIAMOND series of high-end image cards Lexar Professional CEexpress Type B memory cards has been recognized by the organizers and won the Videomaker Best of CES 2023 award for its innovative product design and excellent performance configuration.

(Videomaker Best of CES 2023 Award)

In 2022, Jiang Bolong successively participated in exhibitions in Germany, Japan, the United States and other countries and regions, aiming to narrow the distance with overseas markets, facilitate the company to provide products and services to foreign customers more efficiently and quickly, and further expand the international market. The successful conclusion of CES makes a good start for 2023. Jiang Bolong will also have the opportunity to share cutting-edge storage products and technologies with local industry insiders at the embedded Exhibition in Nuremberg in Germany and the computer Exhibition in Taiwan this year.

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