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AMD to adopt New Retail Packaging Design for Ryzen 7000X3D processor

2025-03-04 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Thanks to CTOnews.com netizen South China Wu Yanzu for the clue delivery! CTOnews.com January 8 news, AMD recently officially launched the Ryzen 7000 X3D processor at CES 2023. AMD's website has updated its product page to provide complete specification information about the processor family. Three Ryzen 7000 X3D CPUs will feature a new packaging design.

AMD plans to package the Ryzen 7000 X3D processor in a new PIB (boxed processor) package, with orange and silver theme colors and a LOGO of "3D Vertical Cache technology." AMD wants to make it easier for consumers to distinguish between the X3D and X versions of the Ryzen 7000 series processors by color.

CTOnews.com learned from AMD's product page that the default TDP for Ryzen 7000 X3D CPUs will be reduced by 50W to 120W. In addition, the Tjmax (operating temperature) of the new series has been reduced from 95 ° C (X series) to 89 ° C. This is also 1 ° C lower than the previous generation Ryzen 7 5800 X3D CPU.

Sharp Dragon 7000 X3D desktop processor model and parameters:

R9 7950 X3D: 16 cores 32 threads up to 5.7GHz, 144MB cache, 120W TDP

R9 7900 X3D: 12 cores, 24 threads, up to 5.6GHz, 140MB cache, 120W TDP

R7 7800 X3D: 8 cores, 16 threads, up to 5.0GHz, 104MB cache, 120W TDP

Speaking of overclocking, AMD also doesn't enable full overclocking on new parts. The maximum voltage of the 7000 X3D components will indeed be higher than the previous generation (1.4 vs. 1.1V), but manual overclocking is still impossible. AMD is still reluctant to share full details of its 7000 X3D CPU, which is expected to be released after the official launch in February.

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