Shulou(Shulou.com)11/24 Report--

CTOnews.com, January 6, AMD CEO Su Zifeng elaborated the technology prospect of the future platform on CES 2023, and also brought a number of new products, which continue to use TSMC 7x6amp 5pm 4nm process.

TSMC and Groponde are expected to remain AMD's main contract manufacturing partners by 2025, while Samsung has only won some orders for 14nm's APU and GPU products, according to industry insiders quoted by the Electronic Times.

According to sources, TSMC has won orders for AMD's next-generation CPU and GPU major chips with the help of 3nm, and has signed a contract with AMD to manufacture the new Radeon RX 7000 series mobile GPU using 6nm process.

In addition, AMD will continue to use grid core 12nm and above process technology to manufacture products. It is reported that at the end of 2021, AMD has signed a four-year wafer supply contract with GE Core in order to ensure adequate supply at a time of chip shortage, with an order value of about US $2.1 billion. Samsung seems to have only a small number of orders for 14nm's APU and GPU.

Tu Yuan PixabayAMD is already the biggest customer of TSMC's N6 7nm process platform. It was also reported that AMD is expected to become the second largest customer of TSMC's 5nm process platform in the second half of 2022.

CTOnews.com learned that the Ryzen 7045HX series of processors just launched by AMD uses TSMC's 5nm process, and the first products are expected to be launched by Asustek, Lenovo and Alienware in February. In addition, AMD also launched the Ryzen 7040 series processors using TSMC's 4nm process and the Ruilong 7035max 7030 series processors based on 7nm.

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